Micro manufacturing of metallic films
A future trend in manufacturing is using unconventional and environmental manufacturing solutions for printed circuits. The project is to design a process system which can micro-manufacture a sandwiched metallic layer in order to make a design in circuit boards. Currently, most manufacturing processes use etching for such cases. However, etching produces chemical components which are not environmentally friendly and not easy to recycle. Different micromachining methods are now used to meet the quality and speed of standard processes, while keeping a low environmental impact.
The project is to design and build a device which can perform micromachining applied to PCB (Printed Circuit Board). The aim is to meet the current norms and standards, while matching a design of a circuit.
- Student(s): Hadi Zein, Joe Radi
- Advisor(s): Dr. Roland Bejjani
- Year: 2022-2023